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Core Functions

1. Optical sensor signal amplification & conditioning: Receives weak analog signals from the pre‑aligner optical photo‑sensors (edge notch / flat‑find sensors for silicon wafer). Amplifies, filters and denoises tiny photocurrent signals, converts them into stable analog voltage signals for backend digital acquisition circuit.More products: www.plcva.com
2. Wafer notch / flat edge detection signal processing: Processes optical feedback signals for wafer pre‑alignment. Detects wafer notch or flat orientation mark, provides high‑quality signal source for calculating wafer rotational position and offset angle.
3. Signal isolation and noise suppression: Suppresses electromagnetic interference generated by robot motors, vacuum pumps and plasma‑related modules inside semiconductor tool. Guarantees stable signal quality in high‑EMI factory cabinet environment.
4. Bidirectional signal bridge: Transmits conditioned alignment measurement signals to equipment main control CPU; receives reference voltage and power supply from system control rack, provides regulated power for pre‑aligner optical sensor heads.
5. Hardware fault detection: Monitors sensor signal amplitude and board operating status. Reports sensor disconnection, signal abnormality and board hardware failure to tool host, triggers alarm for maintenance troubleshooting.
6. Stable analog reference output: Provides precise reference bias voltage for pre‑align optical sensors, ensuring consistent detection threshold for wafer edge/notch detection across long‑term production runs.

Applications & Use Cases

This is exclusive OEM spare‑part for TEL 300 mm Clean‑Track Coater‑Developer photoresist processing equipment, installed in the wafer pre‑aligner station of wafer handling subsystem.

1. Wafer pre‑alignment station core signal processing: Processes optical sensor signals for pre‑align unit. Detects wafer notch/flat feature, calculates wafer rotation offset, completes coarse orientation correction before wafer is transferred to process chamber. Accurate pre‑alignment is critical for photoresist coating, exposure and developing process accuracy.
2. Semiconductor photolithography process preparation: Ensures correct angular orientation of 300 mm silicon wafers prior to spin‑coating, developing and lithography exposure steps, prevents mis‑alignment‑caused wafer scrap.plcva.com
3. Wafer robot handling coordination: Cooperates with wafer transfer robot. Delivers alignment offset data to motion control unit, helping robot place wafer with correct angle into process chuck.
4. Process stability guarantee: Reduces signal drift and noise interference, improves pre‑align repeatability, supports high‑volume fab mass production yield.
5. Equipment maintenance & spare‑part replacement: Used as field‑swap spare for defective prealign‑amp boards on legacy TEL Clean‑Track tools. Extends equipment service life without redesigning wafer handling subsystem.