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MDC 3290+ Piezo‑Driven Micro‑Jet Dispensing System , VERMES Microdispensing GmbH

Warranty： 365 days
Quality: Original module
Condition： New / Used
Warehouse: Spot
Delivery time: Shipped in 3 days after payment
Mailbox：plcvarious@foxmail.com

+086 18205988494

Introduction

Main Function

High‑speed piezoelectric drive: The controller outputs precise high‑voltage drive pulses to actuate the piezo actuator inside the valve head, drives ceramic tappet for ultra‑fast open‑close movement; maximum jetting frequency up to 3000 Hz, ultra‑short trigger delay 85 μs.
Multiple configurable dispensing modes: Single‑Shot Mode, Burst Mode, Infinite Mode, External Trigger Mode. Supports storage of up to 40 groups of internal process parameter presets for fast recipe switching between different fluids and products.
Parameter tuning: Adjust jetting amplitude, rising/falling time, pulse width, material supply pressure to precisely control droplet volume; minimum dispensing volume down to 0.5 nL per shot, compatible with fluids ranging from low viscosity up to 2 000 000 mPas.
Multi‑interface industrial communication: PLC trigger I/O (24 V / 5 V signal), RS232 serial port; supports upper‑level automation equipment linkage, remote parameter modification and production data recording.
Supports matched external heater control module, realizes closed‑loop temperature control for fluid box / nozzle (max 175 °C), stabilizes fluid viscosity for consistent dispensing effect for hot‑melt, high‑viscosity glue materials.
Built‑in fault diagnosis: monitors piezo actuator status, wiring faults and abnormal operation; provides alarm feedback for abnormal jetting. The valve adopts quick‑change fluid‑box and top‑adjust structure, tappet‑nozzle calibration can be completed without disassembly, convenient maintenance and fluid replacement.
Non‑contact jetting dispensing, no mechanical contact between nozzle and workpiece, suitable for uneven, fragile or sensitive substrate surfaces.

MDC 3290+ Piezo‑Driven Micro‑Jet Dispensing System

Application & Purpose

High‑precision non‑contact micro‑jetting for tiny‑volume fluid dispensing in advanced manufacturing industries.
Typical process materials: solder paste, conductive adhesive, UV glue, underfill, silicone, hot‑melt adhesive, grease, flux, silver paste and other medium‑high‑viscosity media.
Typical application scenarios: semiconductor packaging, flip‑chip assembly, SMT electronics processing, LED & display module assembly, consumer‑electronics component bonding, automotive electronics sensors, medical device assembly, precision mechanical lubrication dispensing.
Integrated into automated dispensing platforms and production lines, realizes high‑speed, high‑repeatability micro‑dot, line‑shape and pattern dispensing; improves production throughput while reducing glue consumption and product defect rate.